Heat spreader with high heat flux and high thermal conductivity

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United States of America Patent

PATENT NO 10727156
APP PUB NO 20160190037A1
SERIAL NO

15064304

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Abstract

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A system and method is disclosed for fabricating a heat spreader system, including providing a plurality of bottom microporous wicks recessed in a bottom substrate, bonding a center substrate to the bottom substrate, and bonding a top substrate having a top chamber portion to the center substrate to establish a first vapor chamber with said plurality of bottom microporous wicks.

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Patent Owner(s)

Patent OwnerAddress
TELEDYNE SCIENTIFIC & IMAGING LLC1049 CAMINO DOS RIOS THOUSAND OAKS CA 91360

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cai, Steve Qingjun Newbury Park, US 6 5
Chen, Chung-Lung Thousand Oaks, US 24 375
Tsai, Chialun Thousand Oaks, US 16 465

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