Process for manufacturing a package for a surface-mount semiconductor device and semiconductor device

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United States of America Patent

PATENT NO 9640468
SERIAL NO

14839408

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Abstract

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A surface-mount electronic device includes a body of semiconductor material, and a lead frame that includes a plurality of contact terminals. The plurality of contact terminals is electrically connected to the semiconductor body. The contact terminals are formed of sintered material.

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Patent Owner(s)

  • STMICROELECTRONICS S.R.L.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fontana, Fulvio Vittorio Monza, IT 37 120

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