INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE-ON-PACKAGE MECHANISM AND METHOD OF MANUFACTURE THEREOF
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United States of America Patent
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Issued Date -
Jun 30, 2016
app pub date -
Dec 28, 2015
filing date -
Dec 28, 2015
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Abstract
An integrated circuit packaging system, and a method of manufacture thereof, including: a substrate; a metal core interconnect attached to the substrate; an upper connection joint attached above and to the metal core interconnect; and an interposer attached to the upper connection joint.
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