WAVE FILTER PACKAGES AND METHODS FOR MANUFACTURING THE SAME
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United States of America Patent
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Dec 28, 2015
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Dec 25, 2014
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Abstract
A wave filter package and a method for manufacturing wave filter packages are presented. The wave filter package includes a chip, a substrate, and a sealed wall, the sealed wall being set up between the chip and the substrate so as to form a sealed chamber. The distance between the substrate and the chip is minimized, so that the height of the sealed wall can be decreased, thereby reducing the size of a wave filter package.
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