Contact structures with porous networks for solder connections, and methods of fabricating same

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United States of America Patent

PATENT NO 9888584
SERIAL NO

14942781

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Abstract

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A contact pad includes a solder-wettable porous network (310) which wicks the molten solder (130) and thus restricts the lateral spread of the solder, thus preventing solder bridging between adjacent contact pads.

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Patent Owner(s)

  • INVENSAS CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Katkar, Rajesh San Jose, US 220 4364
Shen, Hong Palo Alto, US 238 3081
Uzoh, Cyprian Emeka San Jose, US 329 8954
Wang, Liang Milpitas, US 567 4722

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