COPPER ALLOY FOR ELECTRIC AND ELECTRONIC DEVICE, COPPER ALLOY SHEET FOR ELECTRIC AND ELECTRONIC DEVICE, CONDUCTIVE COMPONENT FOR ELECTRIC AND ELECTRONIC DEVICE, AND TERMINAL

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United States of America Patent

APP PUB NO 20160194735A1
SERIAL NO

14758032

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Abstract

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A copper alloy for an electric and electronic device comprises more than 2 mass % and less than 23 mass % of Zn; 0.1 mass % to 0.9 mass % of Sn; 0.05 mass % to less than 1.0 mass % of Ni; 0.001 mass % to less than 0.10 mass % of Fe; 0.005 mass % to 0.1 mass % of P; and a balance including Cu and unavoidable impurities, in which 0.002≦Fe/Ni<1.5, 3<(Ni+Fe)/P<15, and 0.3

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI MATERIALS CORPORATION2-3 MARUNOUCHI 3-CHOME CHIYODA-KU TOKYO 100-8117
MITSUBISHI SHINDOH CO LTDTOKYO 140-8550

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
MAKI, Kazunari Saitama-shi, JP 74 205
MORI, Hiroyuki Tsukuba-shi, JP 401 3349
YAMASHITA, Daiki Osaka, JP 35 428

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