Semiconductor manufacturing apparatus and semiconductor manufacturing method

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United States of America Patent

PATENT NO 9966248
SERIAL NO

14643753

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Abstract

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In one embodiment, a semiconductor manufacturing apparatus includes a wafer setting module on which a wafer is to be set. The apparatus further includes a cover module configured to cover a portion of the wafer set on the wafer setting module. The apparatus further includes a position controller configured to detect a position of the wafer set on the wafer setting module and control a position of the cover module based on the detected position of the wafer.

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Patent Owner(s)

  • TOSHIBA MEMORY CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Onishi, Takahiro Mie, JP 9 57

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