Method of Fabricating an Electronic Device
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United States of America Patent
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Issued Date -
Jul 7, 2016
app pub date -
Oct 29, 2013
filing date -
Oct 29, 2013
priority date (Note) -
Abandoned
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Abstract
A silicone composition contains I) a shrink additive and II) a curable polyorganosiloxane composition. A method for fabricating an electronic device includes the steps of: 1) interposing the silicone composition between an IHS and a substrate, 2) curing the curable polyorganosiloxane composition to form a cured silicone product, and 3) removing the shrink additive during and/or after step 2), thereby compressing the IHS to the substrate. Compressing occurs as thickness of the cured silicone product decreases, as compared to thickness of the silicone composition interposed in step 1).
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