Light emitting diodes with enhanced thermal sinking and associated methods of operation

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United States of America Patent

PATENT NO 9748461
SERIAL NO

14992787

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Abstract

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Solid state lighting devices and associated methods of thermal sinking are described below. In one embodiment, a light emitting diode (LED) device includes a heat sink, an LED die thermally coupled to the heat sink, and a phosphor spaced apart from the LED die. The LED device also includes a heat conduction path in direct contact with both the phosphor and the heat sink. The heat conduction path is configured to conduct heat from the phosphor to the heat sink.

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Patent Owner(s)

  • MICRON TECHNOLOGY, INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Tetz, Kevin Boise, US 28 193
Watkins, Charles M Eagle, US 129 1925

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