RELEASE FILM, METHOD FOR MANUFACTURING MOLDED ARTICLE, SEMICONDUCTOR COMPONENT, AND REFLECTOR COMPONENT

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United States of America Patent

APP PUB NO 20160200007A1
SERIAL NO

14913706

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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In the release film of the present invention, each of thermal shrinkage ratios in an MD direction and a TD direction at 120° C. is not less than 5%.

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Patent Owner(s)

Patent OwnerAddress
ASAHI KASEI CHEMICALS CORPORATION1-105 KANDA JINBOCHO CHIYODA-KU TOKYO 101-8101

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
KASAMATSU, Chika Tokyo, JP 1 1
MARUYAMA, Mutsuhiro Tokyo, JP 4 47
MATSUKI, Yutaka Tokyo, JP 16 177
SUE, Kenichiro Tokyo, JP 1 1

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