HIGH RIGIDITY INTERLAYERS AND LIGHT WEIGHT LAMINATED MULTIPLE LAYER PANELS
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United States of America Patent
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app pub date -
Oct 9, 2015
filing date -
Mar 9, 2012
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Abandoned
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Abstract
This disclosure is related to the field of polymer interlayers for multiple layer panels and multiple layer panels having at least one polymer interlayer sheet. Specifically, this disclosure is related to the field of high rigidity interlayers and light weight laminated multiple layer panels incorporating high rigidity interlayers.
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