MULTI-LAYERED CERAMIC ELECTRONIC DEVICE, METHOD FOR MAKING SAME
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United States of America Patent
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Jul 14, 2016
app pub date -
Aug 14, 2015
filing date -
Jan 8, 2015
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Abstract
A multi-layered ceramic electronic device is made by attaching respective inner bonding surfaces of two lead frames to two opposite electrode junctions of a multi-layered ceramic chip in such a manner that a predetermined buffer space is defined between respective bottom bonding portions of the lead frames and the bottom side of the multi-layered ceramic chip, and then applying a conductive polymer adhesive to bond the inner bonding surfaces of the lead frames to the electrode junctions of the multi-layered ceramic chip at a predetermined low bonding temperature and to electrically conduct the leaf frames to the electrode junctions of the multi-layered ceramic chip.
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