Low temperature adhesive resins for wafer bonding

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United States of America Patent

PATENT NO 9601364
APP PUB NO 20160204015A1
SERIAL NO

15077113

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Abstract

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A method for adhesive bonding in microelectronic device processing is provided that includes bonding a handling wafer to a front side of a device wafer with an adhesive comprising phenoxy resin; and thinning the device wafer from the backside of the device wafer while the device wafer is adhesively engaged to the handling wafer. After the device wafer has been thinned, the adhesive comprising phenoxy resin may be removed by laser debonding, wherein the device wafer is separated from the handling wafer.

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Patent Owner(s)

  • INTERNATIONAL BUSINESS MACHINES CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Allen, Robert D San Jose, US 65 948
Andry, Paul S Yorktown Heights, US 122 1850
Gelorme, Jeffrey D Burlington, US 83 1125
Hung, Li-wen Mahopac, US 69 241
Knickerbocker, John U Yorktown Heights, US 263 3934
Tsang, Cornelia K Mohegan Lake, US 63 1535

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