WIRING BOARD WITH INTERPOSER AND DUAL WIRING STRUCTURES INTEGRATED TOGETHER AND METHOD OF MAKING THE SAME
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United States of America Patent
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Issued Date -
Jul 14, 2016
app pub date -
Jan 12, 2016
filing date -
Jan 14, 2015
priority date (Note) -
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status (Latency Note)
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Abstract
A wiring board with integrated interposer and dual wiring structures is characterized in that an interposer and a first wiring structure are positioned within a through opening of a stiffener whereas a second wiring structure is disposed beyond the through opening of the stiffener. The mechanical robustness of the stiffener can prevent the wiring board from warping. The interposer provides primary fan-out routing for a semiconductor device to be assembled thereon. The first wiring structure can further enlarge the pad size and pitch of the interposer, whereas the second wiring structure not only provides further fan-out wiring structure, but also mechanically binds the first wiring structure with the stiffener.
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