Semiconductor apparatus and manufacturing method for same
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United States of America Patent
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Jun 20, 2017
Issued Date -
N/A
app pub date -
Sep 4, 2013
filing date -
Sep 4, 2013
priority date (Note) -
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status (Latency Note)
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Abstract
According to the embodiments, a semiconductor device includes a substrate, a plurality of insulating layers, a lower shield plate, a semiconductor device, an upper shield plate, and a side shield member. A first contact portion is formed on the substrate. The lower shield plate includes a magnetic substance and is provided above the substrate so as to avoid the first contact portion. The semiconductor chip is provided above the lower shield plate and has a second contact portion electrically connected to the first contact portion. The upper shield plate includes a magnetic substance and is provided above the semiconductor chip so as to avoid the second contact portion and a connection member. The side shield member includes a magnetic substance and connects side portions of the lower shield plate and the upper shield plate on which the connection member is not disposed.
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