METHOD FOR MANUFACTURING ELECTRONIC DEVICE BY USING FLIP-CHIP BONDING
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United States of America Patent
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Issued Date -
Jul 14, 2016
app pub date -
Jan 14, 2015
filing date -
Jan 14, 2015
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
An electronic device is manufactured by providing a substrate on which a pad including an organic solderability preservative (OSP) film is formed, mounting a die on the substrate such that the die is electrically connected to the pad, performing a molding process on the die mounted on the substrate, and thereafter, forming an oxide film on the substrate by using an oxidation process on the substrate.
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