Integrated circuit heat dissipation using nanostructures

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United States of America Patent

PATENT NO 9666701
SERIAL NO

15074165

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Abstract

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An approach for heat dissipation in integrated circuit devices is provided. A method includes forming an isolation layer on an electrically conductive feature of an integrated circuit device. The method also includes forming an electrically conductive layer on the isolation layer. The method additionally includes forming a plurality of nanowire structures on a surface of the electrically conductive layer.

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Patent Owner(s)

  • INTERNATIONAL BUSINESS MACHINES CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Botula, Alan B Essex Junction, US 52 638
Lifson, Max L South Burlington, US 19 52
Slinkman, James A Montpelier, US 71 889
Van, Kessel Theodore G Millbrook, US 182 1541
Wolf, Randy L Essex Junction, US 62 346

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