COVER FILM WITH HIGH DIMENSIONAL STABILITY AND MANUFACTURING METHOD OF FLEXIBLE PRINTED CIRCUIT BOARD
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United States of America Patent
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Issued Date -
Jul 14, 2016
app pub date -
Feb 12, 2015
filing date -
Feb 12, 2015
priority date (Note) -
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Abstract
A cover film with high dimensional stability includes an insulation film, a first adhesive layer, and a carrier. A first side of the first adhesive layer is connected to a first surface of the insulation film, and a second side of the first adhesive layer is configured to adhere to at least one metal conductor of a flexible printed circuit board. The carrier includes a supporting film and a second adhesive layer. A first side of the second adhesive layer is connected to the supporting film, and a second side of the second adhesive layer is adhered to a second surface of the insulation film, wherein bonding strength of the second adhesive film is smaller than bonding strength of the first adhesive film.
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