PRINTED CIRCUIT BOARD AND METHOD FOR FABRICATING THE SAME
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United States of America Patent
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Issued Date -
Jul 14, 2016
app pub date -
Apr 30, 2015
filing date -
Jan 12, 2015
priority date (Note) -
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status (Latency Note)
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Abstract
A printed circuit board is provided, including a products area, an outline area, a plurality of cutting channels, and at least one measurement unit. The products area includes a plurality of circuit board units arranged in a matrix, and each of the circuit board units has a plurality of first internal wiring layers. The outline area surrounds the products area. The cutting channels are located between the outline area and the circuit board units, and between the circuit board units. The measurement unit is disposed in one of the cutting channels and has a plurality of second internal wiring layers and a plurality of contact pads. The second internal wiring layers and the first internal wiring layers are formed by the same fabrication processes. The contact pads are electrically connected to the second internal wiring layers and exposed to a surface of the printed circuit board.
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