Microneedle device and method of preparation
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United States of America Patent
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Mar 26, 2019
Grant Date -
Jul 21, 2016
app pub date -
Aug 18, 2014
filing date -
Aug 20, 2013
priority date (Note) -
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Abstract
Microneedle devices have projections that are generally sharp and elongated and designed to disrupt the upper layer of the skin, cause micro-indentations, or pierce the skin. High density arrays are produced using micro-fabrication or micro-molding techniques. The assembly of individual needles does not lend itself to the production of high density arrays. A method of forming microneedle arrays is disclosed which comprises attaching a plurality of microneedles to a substrate, and building up a 2-dimensional microneedle array by wrapping layers of the substrate around a core or folding the layers repeatedly back upon themselves. The arrays are capable of needle densities with a pitch within the range of needle radius plus several micrometers to millimeters.
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