Resin composition for printed circuit board, resin varnish using the same, adhesive film, prepreg and printed wiring board

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United States of America Patent

PATENT NO 10626288
APP PUB NO 20160208143A1
SERIAL NO

14949177

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Abstract

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A resin composition for a printed circuit board includes an epoxy resin; an active ester hardening agent configured to react with the epoxy resin; and a cyanate ester hardening agent.

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Patent Owner(s)

  • SAMSUNG-ELECTRO-MECHANICS CO. LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kim, Ki-Seok Incheon-si, KR 21 107
Shim, Ji-Hye Suwon-si, KR 15 41
Woo, Ji-Eun Seoul, KR 3 2

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