Sheet for semiconductor processing
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United States of America Patent
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Jan 29, 2019
Grant Date -
Jul 21, 2016
app pub date -
Aug 29, 2014
filing date -
Aug 30, 2013
priority date (Note) -
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Abstract
A semiconductor processing sheet, the sheet comprising a base material and a pressure sensitive adhesive layer laminated on at least one surface of the base material, the pressure sensitive adhesive layer being formed of a pressure sensitive adhesive composition, the pressure sensitive adhesive composition containing a polymer having a salt and an energy ray curable group and an energy ray curable pressure sensitive adhesive component (excluding the above polymer). The semiconductor processing sheet can suppress contamination of an adherent at the time of peeling after energy ray irradiation while exhibiting a sufficient antistatic property.
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