SEMICONDUCTOR ASSEMBLY HAVING WIRING BOARD WITH ELECTRICAL ISOLATOR AND MOISTURE INHIBITING CAP INCORPORATED THEREIN AND METHOD OF MAKING WIRING BOARD
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United States of America Patent
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Issued Date -
Jul 21, 2016
app pub date -
Mar 24, 2016
filing date -
Mar 7, 2014
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Abstract
A method of making a wiring board is characterized by the provision of moisture inhibiting caps covering interfaces between an electrical isolator/optional metal posts and a surrounding plastic material. In a preferred embodiment, the electrical isolator and metal posts are bonded to the resin core by an adhesive substantially coplanar with the metal layers on two opposite sides of the resin core, the metal posts and a thermally conductive slug that includes the electrical isolator at smoothed lapped top and bottom surfaces, so that a metal bridge can be deposited on the adhesive at the smoothed lapped bottom surface to completely cover interfaces between the electrical isolator/metal posts and the surrounding plastic material. Conductive traces are also deposited on the smoothed lapped top surface to provide electrical contacts for chip connection and electrically coupled to the metal posts.
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