LAMINATED CHIP AND LAMINATED CHIP MANUFACTURING METHOD

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20160211243A1
SERIAL NO

14969015

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A laminated chip includes: a first chip; a first wiring layer formed on the first chip; a second chip; a second wiring layer formed on the second chip; and a layer disposed between the first wiring layer and the second wiring layer, the layer includes an adhesive agent configured to bond the first wiring layer and the second wiring layer; a plurality of first bumps connected to the first wiring layer; a plurality of second bumps connected to the second wiring layer; and solder connected to the plurality of first bumps and the plurality of second bumps.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
FUJITSU LIMITEDKAWASAKI18047

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Baba, Shunji Yokohama, JP 88 575
KAINUMA, NORIO Nagano, JP 53 215
KANDA, TAKASHI Kawasaki, JP 85 550
SUWADA, MAKOTO Kawasaki, JP 25 36

Cited Art Landscape

Patent Info (Count) # Cites Year
 
DENSO CORPORATION (1)
* 2004/0262,753 Flip chip packaging structure and related packaging method 19 2004
 
SONY CORPORATION (1)
* 2012/0241,949 SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND METHOD OF MANUFACTURING WIRING BOARD 2 2012
 
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (1)
* 2012/0153,433 Tuning the Efficiency in the Transmission of Radio-Frequency Signals Using Micro-Bumps 10 2010
 
FUJITSU LIMITED (2)
* 5477160 Module test card 134 1993
* 2007/0222,039 Semiconductor device and manufacturing method of a semiconductor device 1 2006
* Cited By Examiner

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
SAMSUNG ELECTRONICS CO., LTD. (1)
* 9773758 Semiconductor device with magnetically aligned chips and method for fabricating the same 0 2016
* Cited By Examiner