Electronic component and electronic component-mounted structure

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10840008
APP PUB NO 20160212850A1
SERIAL NO

14988800

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Abstract

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An electronic component includes an electronic component body and an external electrode. The external electrode is disposed on the electronic component body. The external electrode includes a Pd plating layer and a Ni plating layer. The Pd plating layer defines an outermost layer. The Ni plating layer is disposed inside the Pd plating layer. The Ni plating layer is partly exposed from the Pd plating layer.

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Patent Owner(s)

  • MURATA MANUFACTURING CO LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kainuma, Yasuaki Nagaokakyo, JP 5 24
Katsuta, Seiji Nagaokakyo, JP 13 126
Motoki, Akihiro Nagaokakyo, JP 90 1147

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