Curable composition for printed circuit board, and cured coating film and printed circuit board incorporating same
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United States of America Patent
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Sep 1, 2020
Grant Date -
Jul 28, 2016
app pub date -
Sep 30, 2014
filing date -
Sep 30, 2013
priority date (Note) -
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status (Latency Note)
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Abstract
Provided are: a curable composition that has excellent flexibility and shows excellent adhesion to both a plastic substrate and a conductor layer; a coating film of the curable composition; and a printed circuit board comprising a pattern-cured coating film obtained from the coating film. The present invention relates to: a curable composition for a printed circuit board, which is characterized by comprising (A) a block copolymer, (B) a hydroxyl group-containing (meth)acrylate compound and (C) a photopolymerization initiator; a coating film obtained by photo-curing the curable composition; and a printed circuit board comprising a resist pattern formed from the coating film.
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