SUPPORT MOUNTED ELECTRICALLY INTERCONNECTED DIE ASSEMBLY

United States of America Patent

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Issued Date
Jul 28, 2016
app pub date
Mar 31, 2016
filing date
Mar 12, 2008

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Abstract

Stacked die assemblies are electrically connected to connection sites on any support, without electrical connection to any interposed substrate or leadframe, and without solder.

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Patent Owner(s)

Patent Owner	Address
INVENSAS CORPORATION	3025 ORCHARD PARKWAY SAN JOSE CA 95134

International Classification(s)

H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

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[Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Andrews,, JR Lawrence Douglas	Scotts Valley, US	12	404
McElrea, Simon J S	Scotts Valley, US	17	369
Robinson, Marc E	San Jose, US	16	655

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SUPPORT MOUNTED ELECTRICALLY INTERCONNECTED DIE ASSEMBLY

Number of patents in Portfolio can not be more than 2000

United States of America Patent

15086693

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15086693

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