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Abstract

In one example of forming a printable vertical LED that can emit light from its top and bottom surfaces, a transparent insulating material, such as silicon nitride, is formed over the bottom semiconductor layers of the LED. The insulating material is then patterned to expose portions of the conductive semiconductor layer or a transparent current spreading layer. The shape and thickness of the patterned insulating material over the bottom surface can be selected to achieve a desired orientation of the printed LED and the desired spreading of current. A thin layer of a transparent conductive material is then deposited over the surfaces of the insulating material and the exposed semiconductor surface, including the sidewalls of the openings. The top bump of the LED may be formed using the existing undoped GaN as the patterned insulating material, or an insulating layer may be deposited and patterned.

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First Claim