BONDED BODY AND BONDING METHOD

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United States of America Patent

APP PUB NO 20160221254A1
SERIAL NO

14908338

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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In a bonded body (1), a first member (2), and a second member (3) formed of a material different from that of the first member (2) are bonded to each other via a bonding layer (4) interposed therebetween. In a range of 13 μm in a cross-section of a bonding interface between the first member (2) and the bonding layer (4), the number of air bubbles having a void area of 1.5×10−3 μm2 or greater is 100 or less.

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Patent Owner(s)

Patent OwnerAddress
ASAHI KASEI CHEMICALS CORPORATION1-105 KANDA JINBOCHO CHIYODA-KU TOKYO 101-8101

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
NAGATA, Kazuya Tokyo, JP 7 169
SAITO, Taiga Tokyo, JP 3 7

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