BONDED BODY AND BONDING METHOD
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United States of America Patent
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Aug 4, 2016
app pub date -
Aug 11, 2014
filing date -
Aug 15, 2013
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Abstract
In a bonded body (1), a first member (2), and a second member (3) formed of a material different from that of the first member (2) are bonded to each other via a bonding layer (4) interposed therebetween. In a range of 13 μm in a cross-section of a bonding interface between the first member (2) and the bonding layer (4), the number of air bubbles having a void area of 1.5×10−3 μm2 or greater is 100 or less.
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