METHOD OF SELECTIVELY TREATING COPPER IN THE PRESENCE OF FURTHER METAL
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United States of America Patent
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Aug 4, 2016
app pub date -
Oct 14, 2014
filing date -
Oct 21, 2013
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Abstract
The present invention relates to a method of selectively treating the surface of copper or copper alloys without affecting other metals, particularly tin. The methods are suited for treating surfaces of copper or copper alloys in order to facilitate subsequent deposition of metal layers and enhance solderability of the surfaces of copper, copper alloys and said subsequently deposited metal layers. The methods are applied to printed circuit boards (PCBs) and lead frames or integrated circuit substrates (IC substrates).
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