SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
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United States of America Patent
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Issued Date -
Aug 4, 2016
app pub date -
Jul 17, 2015
filing date -
Jul 17, 2015
priority date (Note) -
Abandoned
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Abstract
A semiconductor device according to an embodiment includes a metal part including a first surface and a second surface on an opposite side to the first surface. A semiconductor chip is mounted on the first surface of the metal part and is electrically connected to the metal part. A terminal part includes a third surface being in contact with the second surface of the metal part, a fourth surface on an opposite side to the third surface, and side surfaces between the third surface and the fourth surface. A resin is provided on the second surface of the metal part and the side surfaces of the terminal part.
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