Electronic assembly that includes stacked electronic devices
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United States of America Patent
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Apr 25, 2017
Grant Date -
Aug 4, 2016
app pub date -
Dec 16, 2014
filing date -
Dec 16, 2014
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The electronic package includes a substrate and an electronic component mounted to a surface of the substrate. An interposer is mounted to the surface of the substrate such that the interposer surrounds the electronic component and is electrically connected to the substrate. An over-mold covers the electronic component. In other forms, the example electronic package may be incorporated into an electronic assembly. The electronic assembly further includes a second electronic component mounted to the interposer. As an example, the second electronic component may be mounted to the interposer using solder bumps. It should be noted that any technique that is known now, or discovered in the future, may be used to mount the second electronic component to the interposer.
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