FLUX AND METHOD OF MANUFACTURING ELECTRONIC DEVICE

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20160228999A1
SERIAL NO

14982342

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A flux used for bonding a solder includes: 75 wt % or more of ethylene glycol polymer represented by the following formula: HO(CH2CH2O)nH [n is an integer of 4 or more], wherein an evaporation of the ethylene glycol polymer while being heated is terminated at a temperature equal to or greater than a bonding temperature of the solder.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddressTotal Patents
FUJITSU LIMITEDKAWASAKI18361

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Imaizumi, Nobuhiro Atsugi, JP 41 274
Sakuyama, Seiki Yamato, JP 56 289
Shimizu, Kozo Atsugi, JP 33 152

Cited Art Landscape

Patent Info (Count) # Cites Year
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (1)
* 2012/0217,290 Flux Composition and Techniques for Use Thereof 0 2012
 
NEKTAR THERAPEUTICS (1)
* 2007/0092,482 Conjugates of a G-CSF moiety and a polymer 9 2006
* Cited By Examiner

Patent Citation Ranking

Forward Cite Landscape

  • No Forward Cites to Display