FLUX AND METHOD OF MANUFACTURING ELECTRONIC DEVICE

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United States of America Patent

APP PUB NO 20160228999A1
SERIAL NO

14982342

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Abstract

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A flux used for bonding a solder includes: 75 wt % or more of ethylene glycol polymer represented by the following formula: HO(CH2CH2O)nH [n is an integer of 4 or more], wherein an evaporation of the ethylene glycol polymer while being heated is terminated at a temperature equal to or greater than a bonding temperature of the solder.

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Patent Owner(s)

Patent OwnerAddress
FUJITSU LIMITED1-1 KAMIKODANAKA 4-CHOME NAKAHARA-KU KAWASAKI-SHI KANAGAWA 211-8588

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Imaizumi, Nobuhiro Atsugi, JP 41 291
Sakuyama, Seiki Yamato, JP 56 304
Shimizu, Kozo Atsugi, JP 33 159

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