FLUX AND METHOD OF MANUFACTURING ELECTRONIC DEVICE

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United States of America Patent

APP PUB NO 20160228999A1
SERIAL NO

14982342

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A flux used for bonding a solder includes: 75 wt % or more of ethylene glycol polymer represented by the following formula: HO(CH2CH2O)nH [n is an integer of 4 or more], wherein an evaporation of the ethylene glycol polymer while being heated is terminated at a temperature equal to or greater than a bonding temperature of the solder.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
FUJITSU LIMITEDKAWASAKI17796

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Imaizumi, Nobuhiro Atsugi, JP 41 280
Sakuyama, Seiki Yamato, JP 56 294
Shimizu, Kozo Atsugi, JP 33 155

Cited Art Landscape

Patent Info (Count) # Cites Year
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (1)
* 2012/0217,290 Flux Composition and Techniques for Use Thereof 0 2012
 
NEKTAR THERAPEUTICS (1)
* 2007/0092,482 Conjugates of a G-CSF moiety and a polymer 11 2006
* Cited By Examiner

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