Communication Module and Signal Transmission Device Including the Same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20160231516A1
SERIAL NO

14614508

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Abstract

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Space usable in various usages is ensured between a board and a communication module mounted on the board. A communication module is mounted on a motherboard inside a signal transmission device, and the communication module includes: a module frame having a lower plate and an upper plate facing each other and that contains a module board between the lower plate and the upper plate; and a male connector that is protruded from the lower plate and connected to a female connector provided in the motherboard. When the male connector is connected to the female connector, a gap is formed between the lower plate of the module frame and the motherboard.

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Patent Owner(s)

Patent OwnerAddress
HITACHI METALS LTD2-1 SHIBAURA 1-CHOME MINATO-KU TOKYO 105-8614

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
ISHIGAMI, Yoshiaki Hitachi, JP 66 906
OHKUBO, Chihiro Mito, JP 5 22
SUNAGA, Yoshinori Hitachinaka, JP 77 538
YAMAZAKI, Kinya Hitachi, JP 35 214

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