Partial layer transfer system and method

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10236282
APP PUB NO 20160233206A1
SERIAL NO

15026268

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Abstract

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An embodiment includes an apparatus comprising: a first layer, including a first semiconductor switching element, coupled to a first portion of a first bonding material; and a second layer, including a second semiconductor switching element, coupled to a second portion of a second bonding material; wherein (a) the first layer is over the second layer, (b) the first portion is directly connected to the second portion, and (c) first sidewalls of the first portion are unevenly serrated. Other embodiments are described herein.

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Patent Owner(s)

  • INTEL CORP.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Baskaran, Rajashree Seattle, US 42 268
Fischer, Paul B Portland, US 94 393
Jun, Kimin Hillsboro, US 100 360
Morrow, Patrick Portland, US 218 2491
Son, Il-Seok Portland, US 11 29

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