CIRCUIT BOARD ASSEMBLY
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United States of America Patent
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Issued Date -
Aug 11, 2016
app pub date -
Sep 18, 2014
filing date -
Sep 18, 2013
priority date (Note) -
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Abstract
A circuit board assembly is described. The circuit board assembly comprises a circuit board comprising a substrate supporting a plurality of contact lands and a device, such as a bare die or printed circuit board, comprising a plurality of contact pads which is mounted on the circuit board such that the contact pads are aligned with the contact lands. The circuit board assembly comprises an interconnect layer which has a sheet resistance, Rs, of at least 0.5 MΩ/sq, which is disposed between the device and the circuit board and which is arranged to provide electrical connections between the contact lands and corresponding contact pads.
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