SHEET FOR SEALING AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

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United States of America Patent

APP PUB NO 20160237288A1
SERIAL NO

14912866

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Abstract

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Provided is a sheet for sealing in which a semiconductor chip is to be embedded, and a surface of the sheet has a surface specific resistance value of 1.0×1012Ω or less.

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Patent Owner(s)

Patent OwnerAddress
NITTO DENKO CORPORATIONOSAKA 567-8680

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Mizuno, Koji Ibaraki-shi, Osaka, JP 40 427
Shiga, Goji Ibaraki-shi, Osaka, JP 50 207

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