NOVEL ADHESION PROMOTING AGENTS FOR METALLISATION OF SUBSTRATE SURFACES
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United States of America Patent
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Aug 18, 2016
app pub date -
Sep 22, 2014
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Sep 26, 2013
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Abstract
A method is provided for metallisation of non-conductive substrates providing a high adhesion of the deposited metal to the substrate material and thereby forming a durable bond. The method applies a novel combination of a metal oxide compound to promote adhesion and a transition metal plating catalyst compound promoting the metal layer formation.
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