ELECTROPLATING WITH REDUCED AIR BUBBLE DEFECTS
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United States of America Patent
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Aug 18, 2016
app pub date -
Feb 12, 2015
filing date -
Feb 12, 2015
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Abstract
A method for processing a wafer includes holding the wafer in a face-up position with a seal ring contacting the wafer on a contact circumference. A bead of liquid is applied onto the entire contact circumference, with the bead of liquid contacting the wafer and the seal ring. The wafer is then inverted into a head-down position, lowered into contact with electrolyte and plated with a conductive film. Formation of the bead of liquid helps to displace air bubbles as the wafer is immersed into the electrolyte which reduces plating defects.
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