Methods and systems for improving heat dissipation, signal integrity and electromagnetic interference (EMI) shielding in optical communications modules
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United States of America Patent
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Oct 18, 2016
Grant Date -
Aug 18, 2016
app pub date -
Feb 12, 2015
filing date -
Feb 12, 2015
priority date (Note) -
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Abstract
An optical communications module is provided that has improved heat dissipation, signal integrity and/or EMI shielding solutions. The heat dissipation solution thermally decouples the light source driver circuitry from the light source such that heat generated by the light source driver circuitry does not increase the temperature of the light source to the point that its performance is degraded. The heat dissipation solution may also include convective heat transfer features for further improving heat dissipation. The EMI solution includes features that increase the number of contact points between the outer surface of the module housing and EMI fingers of a cage that receives the module. The signal integrity solution includes features that reduce inductive coupling to improve impedance matching between electrical interconnections, thereby improving signal integrity.
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