Electronic devices with multi-layer heat reduction components
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United States of America Patent
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Sep 5, 2017
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app pub date -
Feb 13, 2015
filing date -
Feb 13, 2015
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Abstract
In one example in accordance with the present disclosure an electronic device with a multi-layer heat reduction component is described. The device includes a number of integrated circuits and a first layer in contact with at least one of the number of integrated circuits to remove heat from at least one integrated circuit. The device also includes a second layer separated from the first layer by an air gap to reduce heat transfer between the first layer and the second layer. The second layer is retractable to expose the first layer when docked to a station. The electronic device operates in a first mode when docked to a station and a second mode when not docked to the station.
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