CHUCK TABLE OF PROCESSING APPARATUS
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United States of America Patent
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Issued Date -
Aug 18, 2016
app pub date -
Feb 12, 2016
filing date -
Feb 12, 2015
priority date (Note) -
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status (Latency Note)
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Abstract
A chuck table in processing apparatus holds a frame unit in which a wafer is fixed to an opening of a ring-shaped frame with an intermediary of adhesive tape by sucking an exposed surface of the wafer to a holding surface. The chuck table includes a circular region that forms the holding surface in which plural suction holes communicating with a suction source are formed, and a ring-shaped circumferential region that surrounds the circular region. The diameter of the circular region is smaller than the diameter of the wafer. The circumferential region is formed to include a diameter larger than the diameter of the wafer and smaller than the inner diameter of the ring-shaped frame, and a recess that suppresses the sticking of the adhesive tape is formed in an upper surface of the circumferential region that gets contact with the adhesive tape.
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