HYBRID CIRCUIT BOARD AND METHOD FOR MAKING THE SAME, AND SEMICONDUCTOR PACKAGE STRUCTURE
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United States of America Patent
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Issued Date -
Aug 18, 2016
app pub date -
Jul 17, 2015
filing date -
Jul 17, 2015
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A hybrid circuit board includes an insulate molding layer having a first surface and a second surface which is opposite to the first surface, a solder mask layer on the first surface, a conductive patterned layer on the first surface and embedded in the solder mask layer, and a plurality of conductive pillars embedded in the insulate molding layer. The thickness of the conductive patterned layer is substantially equal to the thickness of the solder mask layer. Each of conductive pillars has a first end electrically connected to the conductive patterned layer and a second end exposing to the insulated molding layer. The hybrid circuit board is cheap and can effectively avoid the warping of semiconductor packaging structure. A method for making the hybrid circuit board and a semiconductor packaging structure using the hybrid circuit board are also provided.
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