Planarity-tolerant reworkable interconnect with integrated testing

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United States of America Patent

PATENT NO 9865569
SERIAL NO

15137123

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Abstract

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A structure includes an electrical interconnection between a first substrate including a plurality of protrusions and a second substrate including a plurality of solder bumps, the plurality of protrusions includes sharp tips that penetrate the plurality of solder bumps, and a permanent electrical interconnection is established by physical contact between the plurality of protrusions and the plurality of solder bumps including a metallurgical joint.

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Patent Owner(s)

  • INTERNATIONAL BUSINESS MACHINES CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Dang, Bing Chappaqua, US 159 1444
Knickerbocker, John U Monroe, US 263 3936
Liu, Yang Ossining, US 1680 6507
Luo, Yu Hopewell Junction, US 104 545
Wright, Steven L Cortlandt Manor, US 46 810

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