SEMICONDUCTOR DEVICE HAVING A SILICON AND GERMANIUM MATERIAL FILLING A CAVITY REGION COMPRISING A NOTCH REGION FORMED WITHIN A SEMICONDUCTOR SUBSTRATE

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United States of America Patent

SERIAL NO

14691511

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Abstract

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The present invention is directed to semiconductor processes and devices. More specifically, embodiments of the present invention provide a semiconductor device that comprises a shaped cavity formed from two trench structures, and the shaped cavity is filled with silicon and germanium material. There are other embodiments as well.

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Patent Owner(s)

Patent OwnerAddress
SHANGHAI HUALI MICROELECTRONICS CORPORATIONNO 6 LIANGTENG ROAD PUDONG NEW AREA SHANGHAI 201314

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Kun Shanghai, CN 67 210
Li, Fang Shanghai, CN 113 294
Zhu, Yefang Shanghai, CN 4 6

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