Electrostatic discharge protection for a balun
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United States of America Patent
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Aug 15, 2017
Grant Date -
Aug 18, 2016
app pub date -
Feb 18, 2015
filing date -
Feb 18, 2015
priority date (Note) -
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status (Latency Note)
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Abstract
A die is mounted in an integrated circuit package. The die includes a balun circuit and an electrostatic discharge (ESD) circuit coupled to a ground of the integrated circuit die. The package has a first output pin coupled to a first terminal of the balun and has a second output pin coupled to a second terminal of the balun through first and second bond wires. The second output pin is connected to board ground. A third bond wire is disposed between the second package terminal and the ESD circuit to provide a safe discharge path through the third bond wire for ESD events affecting the first and second output terminals. Thus, a charge that builds up involving one of the output terminals coupled to the balun can be safely dissipated.
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