Prepreg mica tape and coil using same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10373727
APP PUB NO 20160247595A1
SERIAL NO

15027802

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Abstract

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A prepreg mica tape includes: a backing material (3); a boron nitride-containing layer (1) that is provided on or above one surface of the backing material (3) and that includes a boron nitride particle (5) and a first resin (4); and a mica-containing layer (2) that is provided on or above the surface of the backing material (3) on which the boron nitride-containing layer (1) is provided and that includes mica (6) and a second resin (4).

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Patent Owner(s)

Patent OwnerAddress
RESONAC CORPORATIONTOKYO

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Song, Shihui Tokyo, JP 9 15
Takezawa, Yoshitaka Tokyo, JP 79 431
Yamamoto, Takaya Tokyo, JP 70 734

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