PROCESS AND SYSTEM FOR THE SUBMICRON STRUCTURING OF A SUBSTRATE SURFACE

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United States of America Patent

APP PUB NO 20160247665A1
SERIAL NO

15027331

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The subject of the invention is a process for submicron structuring of a surface (6) of a substrate (3) comprising the steps of generating a plasma at atmospheric pressure above said surface (6); and of injecting onto said surface (3), through said plasma, at least one gaseous precursor by means of at least one capillary (5) of submicron diameter.

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Patent Owner(s)

Patent OwnerAddress
CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE75794 PARIS CEDEX 16

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Amaral, Thiago Silva Jardim das Americas Parana, BR 1 0
Belmonte, Thierry Neuves-Maisons, FR 3 26
Cardoso, Rodrigo Perito Vista Alegre Curibita Parana, BR 1 0
Gries, Thomas Liverdun, FR 20 66
Noel, Cedric Nancy, FR 1 0

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