SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
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United States of America Patent
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Issued Date -
Aug 25, 2016
app pub date -
Sep 8, 2015
filing date -
Feb 19, 2015
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
In one embodiment, a semiconductor device includes a substrate, and a gate conductor provided on the substrate. The device further includes a first insulator provided on the gate conductor, a second insulator provided on the first insulator and including an opening, and a third insulator provided on the second insulator and provided in the opening. The device further includes a first contact plug provided in the first and third insulators, positioned in the opening, and electrically connected to the gate conductor.
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