METHOD FOR MANUFACTURING SHIELD PRINTED WIRING BOARD, AND SHIELD FILM AND SHIELD PRINTED WIRING BOARD
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United States of America Patent
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app pub date -
May 3, 2016
filing date -
Dec 20, 2012
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Abstract
A method of manufacturing a shield printed wiring board, a shield film, and a shield printed wiring board, which make it possible to achieve cost reduction, are provided. A method of manufacturing a shield printed wiring board 10 includes the steps of: forming a shield film 1 which includes an insulating layer 7 formed of resin in which polymerization has proceeded so that a resin cure degree is 90% or higher, a metal layer 8a stacked onto the insulating layer 7, and an adhesive layer 8b stacked onto the metal layer 8a; mounting the shield film 1 on a printed board 5; and thermally pressing the shield film 1 and the printed board 5 onto each other.
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